Tutorial Submission Deadline Extended to Aug. 15th, 2022
Digest Submission Deadline Extended to July 25th, 2022
Call for Papers for IEEE PEAC 2022 Released!
Power Semiconductor and WBG Devices
IS7.3.1: GaN Integration Drives Next-Generation Power Systems
Tony Liu Sr. Director IC Design
IS7.3.2: SiC MOSFET Robustness in Various Applications and Extreme Working Conditions
Xueqian Zhong Senior Device Engineer
InventChip Technology Co.,Ltd
IS7.3.3: Infineon latest module solution for ESS PCS design and 3-level topology application
Zhenbo Zhao Lead Principal Engineer
Infineon Technologies Center of Competence(Shanghai) Co.,Ltd.
High Efficiency and Green Energy Solution for Data Center
IS7.4.1: "AC to IC" - Murata's Power Solutions for Open Compute and Data Center
Neil Yang Power Product Expert
Murata (China) Investment Co., Ltd.
IS7.4.2: High efficiency High Power Density Cellular 380V-12V DCX Using Low NFoM Devices and Resonant Drive Transformer
Xinke Wu Professor
IS7.4.3: Increasing the power density and efficiency of PSU for data center using multilevel architecture
Dr. Chen Zhao Professor